Single- and double-sided printed circuit boards.Multilayer boards 4-40 layers.Heavy copper, power boards,back planes Metal backed boards-aluminium.
Mixed dielectric build-up. Arlon thermoset material laminated together with FR-4 forming a 3-layer high frequency board.
Power board with heavy copper,140 µm copper thickness and lead-free HAL. We can offer copper thickness from 18 µm up to 350 µm.